Company Overview
Leading Precision Inc. was founded in 2007 as a local professional semiconductor process equipment manufacturing and service company. In its early days, the company's core business was supplying customized equipment required by back-end semiconductor process manufacturers. It quickly expanded into ultra-high vacuum sputtering systems for back-end semiconductor packaging, LED packaging, and advanced Wafer Level Chip Scale Packaging (WLCSP) and Through Silicon Via (TSV) processes. To date, Leading Precision's products include fully automated Physical Vapor Deposition (PVD) equipment and customized equipment and systems. We are committed to developing back-end semiconductor packaging equipment.
Due to our long-standing expertise in back-end semiconductor process equipment technology, we are confident in providing customers with high-efficiency customized equipment. To ensure we continue to meet our customers' stringent requirements and adhere to the highest standards, Leading Precision will tirelessly maintain the closest working partnership with customers and suppliers. Looking ahead, with the support of our outstanding R&D team, we will continuously pursue quality improvement and continue to provide the best equipment and services.
Core Business Areas
- Back-end Semiconductor Packaging: Wafer Level Chip Scale Packaging (WLCSP), Through Silicon Via (TSV), Bumping process equipment
- Physical Vapor Deposition (PVD): Ultra-high vacuum sputtering systems, metal deposition equipment
- Advanced Packaging Technology: Fan-Out, UBM/RDL seed layer, Cu Pillar processes
- Customized Equipment & Systems: Automated equipment tailored to customer requirements
Company Milestones
Successfully implemented Robusta 300+ into sputtering production lines for advanced packaging processes in 2025.
BSM involves depositing metal layers on the backside of the wafer to enhance thermal dissipation, power delivery, and mechanical strength—a critical step in the CoWoS (Chip-on-Wafer-on-Substrate) packaging process.
Meeting mass production demands for 5nm back-end packaging Bumping UBM/RDL seed layer, with all Phase 1 orders fully delivered
- Robusta300+ selected by customers as the primary mass production equipment for 5nm packaging copper bumps (Cu Bump, UBM/RDL seed layer)
- Participated in the risk production and qualification of the 5nm packaging UBM/RDL seed layer
- Continuous Ultra-High Vacuum Radiation Heating Degas Chamber (MBD 2) awarded the 26th Taiwan SME Innovation Research Award
- Robusta300+ became the primary mass production equipment for UBM/RDL at a major Taiwan foundry's advanced packaging Tainan facility
- Achieved MTBC 8,000 wafers production record, significantly extending maintenance intervals
- Produced ultra-low impedance products for major customers using Robusta300+
- Leading Precision was assessed and certified as meeting ISO9001:2015 requirements
- Entered SMIC for TSV process development and mass production (LPI08190)
- Delivered the fifth Robusta unit to a major Taiwan foundry's Tainan facility
- Robusta300 became the primary mass production equipment for high-end wafer packaging (UBM/RDL) at a major Taiwan foundry
- ChipMOS purchased Griffin chambers for Si-Trench TiW/Au mass production
- Jiangsu Hui Cheng Optoelectronics, a high-end wafer-level packaging manufacturer in China, purchased the third Robusta for gold bump mass production (LPI08189)
- LPI12168 passed mass production validation for sputtering systems using various high-volatility substrates at a major Taiwan foundry
- Officially entered mass production at a major Taiwan foundry's Tainan facility
- LPI12168 passed mass production equipment validation for high-end wafer packaging at a major Taiwan foundry
- ChipMOS purchased the 16th Robusta for TiW/Au, Ti/Cu mass production
- Leading Precision implemented ISO9001:2008 Quality Management System
- LPI12183 entered a major Taiwan foundry's Longtan facility for integrated wafer-level Fan-Out mass production validation
- LPI12168 deployed at a major Taiwan foundry for wafer-level Fan-Out packaging sputtering system development and mass production validation
- A major Taiwan foundry purchased the third Robusta for the Tainan facility (LPI12182)
- ChipMOS purchased the 14th Robusta for TiW/Au, Ti/Cu mass production
- LPI12168 conducted development and mass production validation for high-volatility substrate sputtering systems at a major Taiwan foundry
- LPI12168 passed process validation for Bumping on PI substrate at a major Taiwan foundry
- Caprica began deploying Deep Silicon Etch and Oxide Etch technology for mass production applications and validation at ASE (LPI08183)
- Leading Precision Robusta200 entered Jiangsu Hui Cheng Optoelectronics for gold bump mass production (LPI08182)
- LPI12168 conducted PI wafer Bumping process development at a major Taiwan foundry
- Custom LPI12176 deployed at Korea Semicat for advanced memory process development
- Custom sputtering machine at Wang Silicon Technology participated in metal film sputtering for non-wafer substrates ,such as Probe Cards
- ChipMOS purchased the 10th Robusta for TiW/Au, Ti/Cu mass production
- TSMC Solid State Lighting purchased the second Robusta300 for advanced LED mass production (LPI12179)
- Custom Robusta200 Griffin entered TSMC Solid State Lighting for mass production (LPI08179)
- First single-wafer sputtering machine capable of processing both 200mm and 300mm wafers entered Qun Cheng Technology for mass production (LPI12171)
- ChipMOS purchased the first Robusta300 to begin 300mm gold-bump mass production officially. To officially begin 300mm gold bump mass production.
- Caprica 300 launched
- Caprica 300 Deep Silicon Etcher development received a grant from the Industrial Development Bureau, Ministry of Economic Affairs, Leading Product Development Program
- Lewis330 Etcher entered Micro Probe for MEMS component process development
- Robusta300 Griffin system development received a grant from the National Science Council High-Tech Equipment Advanced Technology Development Program
- Robusta300 entered a major Taiwan foundry for mass production trials (LPI12168)
- Custom 300mm Atomic Layer Deposition (ALD) machine entered a major Taiwan foundry for advanced process R&D (LPI12170)
- Leading Precision implemented an ERP system to enhance operational efficiency
- Leading Precision invested in Caprica 200 Deep Silicon Etcher development
- Robusta300 launched and obtained SEMI S2 certification (LPI12168)
- Leading Precision Inc. was officially established
- Leading Precision headquarters in Zhunan, Miaoli,has been completed
- 300mm UBM (Under Bump Metal) sputtering system development received a grant from the Industrial Development Bureau, Ministry of Economic Affairs ,Leading Product Development Program
- Robusta200 officially began gold bump mass production at ChipMOS (LPI08168, LPI08169)
- Entered China's high-end wafer-level packaging manufacturer Homa Microelectronics (LPI08172 & LPI08173)
Quality Policy
Leading Precision upholds a steadfast commitment to quality by establishing a comprehensive quality management system and obtaining ISO 9001:2015 certification. Our four core quality values:
Quality Excellence
Attention to detail, continuous improvement
Customer Satisfaction
Achieving customer success, creating win-win outcomes
Service Innovation
Pursuit of excellence, no limitations
Full Participation
Collective effort, seamless cooperation
Key Certifications & Awards
- ISO 9001:2015 Quality Management System Certification
- 26th Taiwan SME Innovation Research Award — Continuous Ultra-High Vacuum Radiation Heating Degas Chamber (MBD 2)
- SEMI S2 Certification — Robusta Series Products
- Industrial Development Bureau, Ministry of Economic Affairs ,Leading Product Development Program Grant
- National Science Council High-Tech Equipment Advanced Technology Development Program Grant
Products
Physical Vapor Deposition (Sputtering)
Robusta® 300+ is a fully automated, cluster-type, multi-chamber production platform specifically engineered for the mass production of advanced packaging and heterogeneous integration via physical vapor deposition (PVD) sputtering. The system is equipped with ultra-high vacuum (UHV) PVD chambers, UHV multi-wafer degas chambers (Mini-Batch Degas), and super-low-temperature pre-clean etching chambers (Super Low Temp. Pre-Clean).
Robusta® 300+ exhibits exceptional material compatibility, enabling the precise deposition of thin metallic films such as TiW/Au, Ti/Cu, and AlCu/Ti/NiV/Au onto a wide variety of substrates and carriers, including silicon wafers, glass substrates/carriers, silicon oxide ($\text{SiO}$), silicon nitride ($\text{SiN}$), polyimide (PI), PBO, epoxy molding compound (EMC), and silicon-on-glass (SoG).
Serving as the primary standard sputtering equipment for back-end advanced packaging in 5nm, 3nm, 2nm, and 1.4nm wafer manufacturing, Robusta® 300+ is the world's first production tool to pass 5nm wafer packaging bumping tape-out qualification successfully. In the face of increasingly diverse heterogeneous integration wafers, Robusta® 300+ offers broader and more advanced process flexibility, making it the ideal strategic partner for driving wafer-level advanced packaging into high-volume manufacturing. Furthermore, the system fully complies with automation specifications of advanced semiconductor fabs, with loading/unloading and process data logging seamlessly integrated to meet big data analytics requirements.
The FOUP and Wafer Transfer Module is equipped with a high-speed dual-arm robotic arm that swiftly transfers wafers to the Loadlock Chamber and Aligner. It provides a comprehensive transfer solution for handling warped and heavy wafers resulting from heterogeneous integration.
The main system is equipped with 2 dual-function loadlock chambers (supporting atmospheric alignment and vacuum pump-down), a central high-vacuum transfer chamber, and 6 standard process chamber expansion interfaces, enabling flexible chamber configurations. Pioneering the industry with a vacuum dual-tier robotic arm combined with ultra-high-speed dual-arm transfer, it achieves the highest wafer swap throughput. It also offers comprehensive transfer solutions for overweight and warped wafers resulting from heterogeneous integration.
The Ultra-High Vacuum (UHV) PVD Metal Sputtering Chamber delivers high-quality barrier/seed layers and Back Side Metal (BSM) heat-dissipation layers, achieving film quality comparable to front-end advanced semiconductor equipment. Currently, Robusta® 300+ serves as the primary mass-production equipment for Back Side Metal (BSM) applications in advanced packaging and high-end heterogeneous integration chips. Furthermore, comprehensive Best Known Methods (BKMs) are available for all other metals required in various packaging processes.
The Super Low Temp. Pre-Clean Chamber utilizes Magnetron-Enhanced Reactive Ion Etching (MERIE) technology. Featuring a specialized wafer clamping ring design, it effectively lowers processing temperatures for various heterogeneous integration wafers and minimizes outgassing during the etching process. Proven in mass production at major advanced packaging facilities, this system delivers optimal and highly stable native oxide removal capabilities. Furthermore, the chamber requires no form of dummy pasting, thereby eliminating the need for burn-in and preventative maintenance (PM) when transitioning between different wafer surface materials.
The Ultra-High Vacuum (UHV) Multi-Wafer Mini-Batch Degas Chamber performs variable-temperature baking under UHV conditions. Equipped with maximum-efficiency gas evacuation pumps, it rapidly eliminates outgassed water vapor and organic solvents in the shortest possible time. This system thoroughly removes residual moisture and organic contaminants within heterogeneous integration wafers, making it particularly ideal for heterogeneous integration wafers featuring multi-layer RDLs (Re-Distribution Layers) with high volumes of outgassing. Concurrently, its multi-wafer batch processing architecture delivers optimal throughput performance.
Customized Equipment & Systems
Leading Precision's R&D team consists of industry leaders with extensive experience in vacuum equipment design and manufacturing. Therefore, we can provide customers with customized automated equipment and systems, whether for mass production or laboratory use.
For customized equipment services, our company invests resources not only in a hardware engineering team to tailor equipment and systems to customer requirements but also includes a software engineering team capable of completing programming and personalized human-machine interfaces to meet your specific needs. Leading Precision values customization; even with limited time and budget, we can still produce equipment and systems that meet your specific requirements and enhance your production capacity.
Application Areas
- Wafer Level Chip Scale Packaging (WLCSP): High-density interconnects and fine-pitch RDL
- Through Silicon Via (TSV): 3D IC packaging technology
- Bumping Process: Cu Bump, gold bumps, UBM/RDL seed layer
- LED Packaging: Advanced LED mass production processes
- Advanced Memory Processes: Collaboration with international manufacturers
Contact Us
- Company Name: Leading Precision Inc.
- Chinese Name: 力鼎精密股份有限公司
- Tax ID: 28072066
No. 39, Keyi Street, Jhunan Township, Miaoli County 35059, Taiwan
- Tel: +886-37-779899
- Fax: +886-37-779699
Contact: Mr. Jeff Yin / Hsin Wang
Telephone: +886-37-779899 #6161 / #1161