Leading Precision Inc. - Physical Vapor Deposition (Sputtering)(semiconductor back-end, wafer level packaging, LED packaging, WLCSP, TSV, Wafer-Level Chip Scale Packaging, Through-Silicon Via, PVD, liner/barrier, Robusta, GriFfin, gap fill)

高度制造数位化会降低就业？ —从台积电 VS. 力鼎观察