Leading Precision Inc. - Physical Vapor Deposition (Sputtering)(semiconductor back-end, wafer level packaging, LED packaging, WLCSP, TSV, Wafer-Level Chip Scale Packaging, Through-Silicon Via, PVD, liner/barrier, Robusta, GriFfin, gap fill)

高度製造數位化會降低就業？ —從台積電 VS. 力鼎觀察